D.Eylon
,
S.R.Seagle
材料科学技术（英）
The state of Ti research, development and industry is reviewed in this article. The fifty-year anniversary of Ti technology commercialization in the USA provides an opportunity for a historical perspective. Incorporation of "information-age" tools into alloy development, processing, and production invigorates the technology. Consolidation, diversification and globalization have been transforming the Ti industry in the recent years.
关键词:
QIAO Lijie LIU Rui XIAO Jimei University of Science and Technology Beijing
,
Beijing
,
China
金属学报(英文版)
The effects of stress components on nucleation sites and propagation directions of stress cor- rosion cracks in brass were investigated with specimens under mode Ⅱ and mode Ⅲ loadings. The results indicated that under mode Ⅱ loading,stress corrosion cracks nucleated on the site with maximum normal stress component and propagated along the plane perpendieular to the maximum normal stress,under mode Ⅲ loading,the stress corrosion crack was not evident on the 45°plane due to the general corrosion in aqueous solution with high NH_4OH concentra- tion,while stress corroded in aqueous solution with low NH_4OH concentration, numerous cracks with spacings of 10—150μm were found on the 45°plane with maximum normal stress and no stress corrosion cracks was observed on the plane with maximum shear stress.
关键词:
stress corrosion cracking
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null
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null
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null
Yanwu Xu
材料科学技术（英）
Using mathematical plasticity theories, universal formability (UF) technology has been developed and applied in the automotive stamping engineering and production. As a formability analysis tool, this technology is the major methodology for the development of stamping expert system (solution provider) for (a) product design and feasibility analysis, (b) material automatic selection using nomograms, (c) draw die design using pre-models, and (d) UF and robustness analysis of die performance in finite element analysis (FEA) environment.
关键词:
G.Montay
,
A.Cherouat
,
A.Nussair
,
J.Lu
材料科学技术（英）
Residual stress in coatings is the result of individual particle stress. Their effects may be either beneficial or detrimental, depending upon the magnitude, sign and distribution of the stresses with respect to the external load. Tensile stress which exceeds the elastic limit causes cracking in surface coatings or at the interface between the substrate and the coat. Compressive stress, in general, has a beneficial effect on the fatigue life, crack propagation, coating adhesion and on the durability of the top coat during service. Compressive residual stresses can increase the number of cycles before crack initiation begins through a mean stress effect. Temperature gradients which occur during solidification and subsequent cooling are the principal mode of internal stresses generation. Some parameters influence the residual stress field of both the coating and the substrate. Substrate nature, spraying temperature, thickness of the coat layer, substrate preparation (grit blasting conditions), and velocity of the splats are in the relation with the quality of the coating. In this work, we will describe the role playing by the ceramics coating elaboration on the residual stress gradient in depth of the component. The incremental hole drilling technique has been developed to determine the residual stress gradient in depth of the coat and substrate which must be used with particularly conditions. This new technology has been employed on zirconia, alumina and tungsten carbide plasma sprayed coating.
关键词:
Coating
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null
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null
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Q.S. Liu1
,
2
,
3)
,
L.C. Zhao3)
,
G.X. Dong2) and N.J. Gu1) 1) Heibei University of Technology
,
Tianjin 300130
,
China 2) Tianjin Institute of Technology
,
Tianjin 300191
,
China 3) Harbin University of Technology
,
Harbin 150001
,
China
金属学报(英文版)
Theconstruction changinginthereversetransformation ofthestress induced εMin Fe 17 Mn 10 Cr 5 Si 4 Ni alloy is carefully inspected in transmission electron microscope, and then stress induced εM procedure of reverse transformation is analyzed. The behavior of reverse transformationisdissimilar when the organization of εMis different. The reversetransfor mation ofεM withtheshapeofsingle plateandstripisrelativelyeasy,anditsreversibilityincrystallographiciseasilytocarryout,fortheεM with multilayerstructure,thereversetrans formationtakes placein isolatedlayers, fortheεMthat grows well,thereversetransforma tion isrelatively difficult becauseofthe ductile harmonization between itsinternalorganiza tion structures.
关键词:
stress induced εM
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null
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null
